Fibocom Launches Intel® XMM™ 8160 Powered Global 5G Module

February 26, 2019 - 13:12
Fibocom Launches Intel® XMM™ 8160 Powered Global 5G Module

SHENZHEN, CHINA; BARCELONA, SPAIN - Media OutReach - February 26, 2019 - FIBOCOMWireless (SHE:300638) unveils its Intel powered 5G module for the globalvertical markets at theMobile World Congress in Barcelona, Spain. FG100, the first of Fibocom's5G family modules, featuring the Intel® XMM™ 8160 5G modem, offers a "OneWorld One SKU" solution to enable 5G globally with a standardized M.2 formfactor. 


FG100 is a multi-mode 5G module that includes EN-DC (LTE+5G), 5GNR-FDD/TDD, LTE-FDD/TDD and3G WCDMA, supports 5G Sub-6 GHz internally, andsupports mmW through an external antenna module. It allows blazing downloadspeeds of up to 6Gbps on mmW and 4Gbps on Sub-6 GHz. The improved and uniformdata rates in bandwidth enable cloud-connected, immersive experiences of mobilebroadband such as Virtual Reality or Augmented Reality.  


"Weat Fibocom are proud to present our first 5G module based on Intel's XMM™ 81605G modem. 5G allows for enhanced experience in speed and capacity with ultra-lowlatency," says Tiger Ying, CEO Fibocom. "Building upon our established M.2modules portfolio with Intel modems, our FG100 enables our customers with thenatural migration and easy integration from 4G to 5G."


FG100's One-World-One-SKU multi-mode,global band support, compliant to both NSA and SA networks, offers a similararchitecture and identical interface to its 4G predecessor, and commerciallyavailable L860, with Intel® XMM™ 7560 Gigabit LTE modem.  Both offer PCIe interface (Gen4 for FG100),MIPI and GPIO antenna ports, standard M.2 form factor with global bands, toallow for a 5G ready platform on the proven 4G LTE network, significantlyimproving time to market on 5G vertical solutions such as computing devices, fixedwireless access, and gateways.


To enable fast adoption of 5G inthe vertical markets, Intel and Fibocom have collaborated on a prototypeThunderbolt™ 3 adapter being demonstrated in the Intel booth at MWC.  This adapter enables Windows-based deviceswith Thunderbolt™ 3 ports to have easy cellular connectivity on the go.Initially designed with the Intel® XMM™ 7560 Gigabit LTE modem, the adapter canbe upgraded to the Intel® XMM™ 8160 5G modem when available. A 5G Thunderbolt 3adapter will deliver on the promise of plug and play broadband connectivity onthe go, and requires no external power since it derives power from the hostplatform.


"5G'srevolutionary aspect is in its ability to connect all types of devices andbecome more than just a speed bump for faster phones," says Chenwei Yan, VP& GM Intel's Connected Products and Programs.  "Fibocom's FG100 will help the industry scale5G to multiple market segments including PC's, gateways, IOT devices, andvehicles to deliver experiences that benefit from lower latency, expandedcapacity, and enhanced broadband speeds."


Partners including Arcadyan, D-Link,Gemtek and VVDN will deliver gateway platforms using the Fibocom L860 gigabitLTE M.2 module with plans to upgrade to the FG100 5G M.2 module when available.Thanks to the module's standardized interface and seamless upgradability, thetransition from 4G to 5G is an easy upgrade for customers and allows them toleverage the investment in their 4G platforms.


Our partners shared the followingcomments:



"This partnership will bring 5G into the home. Ourresidential gateways will enable Smart Homes to fulfill their promise ofalways-on connectivity of every consumer device, while unleashing a newgeneration of online immersion and entertainment in the home, defined byseamless Augmented Reality that is lag-free, and 4K/8K gaming, video, andVirtual Reality with a high frame-rate," says G.K. Lee, VP D-Link.



"Fibocom's 4G and 5G modules withIntel XMM modem inside provide a clear and achievable path from 4G to 5Gevolution. We are glad to cooperate with Fibocom and Intel to create 5G readysolutions to our customers," says Fred Yeh, CTO Gemtek.



"We are excited to be a part of the eco-systemto bring 5G into action. The teaming up of Fibocom, Intel and VVDN will empowerthe first wave of 5G based gateway solution. The 5G IoT Gateway will capturethe interest and imagination of OEMs who are looking for expanded capacity,enhanced speeds and low latency," says Vivek Bansal, President Engineering,VVDN Technologies.


FG100 will be available to samplethis year, with commercial availability in 2020. For more information regardingFibocom's product offerings, please contact,or visit our booth at MWC Barcelona 2019, Hall 1, 1E21.

About Fibocom

Fibocom Wireless INC.(SHE:300638), is a leading global provider of wireless modules for the Internetof Things (IoT).  We provide cellularcommunications modules of 5G, LTE, NB-IOT, eMTC, HSPA+ and GSM/GPRS solutionsthat enable secure IoT applications globally across many verticals.  Forover 20 years, we have been delivering a trusted and secure environment intelematics, wireless retail systems, metering and smart grids, securitysystems, routers and gateways, digital signage and mobile internet. Our globalsales channel, logistics, manufacturing and support allow enterprises tosimplify operations, increase efficiency and create new business models.Headquartered Shenzhen, China, our global office locations include Germany,India, Taiwan and the United States.